Compositions for use in the production of integrated circuits an

Details Compositions for use in the production of integrated circuits an Compositions for use in the production of integrated circuits an

1988-12-19

1990-04-17

Pal, Asok

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

156651, 1566591, 156668, 252 792, B08B 308

Patent

active

049171224

ABSTRACT:
A photoresist stripping solution is prepared by adding hydrogen peroxide to concentrated sulphuric acid under controlled temperature conditions, preferably at below 20.degree. C. The concentration of the sulphuric acid in the solution is preferably maintained at at least 80% wt to maximize the concentration of the active stripping species permonosulphuric acid. Stripping solutions having extended storage life have a content of soluble tim compound preferably sodium stannate and preferalby also a phosphonate sequestrant which shows a synergism with the tin compound. Such extended life solutions also preferably have a low content of transition metals and of particles. The stripping solution may be utilized at ambient temperature.

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