Compositions for processing of semiconductor substrates

Details Compositions for processing of semiconductor substrates Compositions for processing of semiconductor substrates

2011-04-12

2011-04-12

Webb, Gregory E (Department: 1761)

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

C510S175000

Reexamination Certificate

active

07922823

ABSTRACT:
Compositions useful in microelectronic device manufacturing for surface preparation and/or cleaning of wafer substrates such as microelectronic device precursor structures. The compositions can be employed for processing of wafers that have, or are intended to be further processed to include, copper metallization, e.g., in operations such as surface preparation, pre-plating cleaning, post-etching cleaning, and post-chemical mechanical polishing cleaning of microelectronic device wafers. The compositions contain (i) alkanolamine, (ii) quaternary ammonium hydroxide and (iii) a complexing agent, and are storage-stable, as well as non-darkening and degradation-resistant in exposure to oxygen.

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