Compositions for moisture curing hot melt adhesives

Details Compositions for moisture curing hot melt adhesives Compositions for moisture curing hot melt adhesives

1996-05-06

1997-07-08

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From reactant having at least one -n=c=x group as well as...

528 44, C08G 1800, C08G 1808, C08G 1818

Patent

active

056462298

ABSTRACT:
The present invention has for its object to obtain a composition for moisture curing hot melt adhesives superior in both moisture curing reactivity after adhesion and thermal stability in the use.
The composition for moisture curing hot melt adhesives according to the present invention is characterized by containing a urethane prepolymer having isocyanate group in its end and a compound having a structure represented by the following formula (I): ##STR1## (where X, Y and Z in the formula (I) are alkyl groups or groups represented by the following formula (II), and at least one of X, Y and Z is a group represented by the formula (II): ##STR2## n in the formula (II) is an integer from 1 through 10, and R.sub.1 and R.sub.2 are hydrogen or alkyl groups.)

REFERENCES:
patent: 4379861 (1983-04-01), Haas et al.
patent: 4404352 (1983-09-01), Suenobu et al.
patent: 4430468 (1984-02-01), Schumacher
patent: 4574793 (1986-03-01), Lee et al.
patent: 5064957 (1991-11-01), Nakasugi
patent: 5091444 (1992-02-01), Bauer et al.

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