Compositions for chemical copper plating

Details Compositions for chemical copper plating Compositions for chemical copper plating

1976-12-28

1979-02-06

Guynn, Herbert B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

427305, 427437, 106 126, C23C 302

Patent

active

041382676

ABSTRACT:
A composition for chemical copper plating having a pH of 12 to 14 and containing a boron hydride compound serving as a reducing agent, a water-soluble copper compound and a copper complexing agent, the composition being characterized in that the copper complexing agent is at least one of hydroxyalkyl-substituted ethylenediamines represented by the formula ##STR1## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are the same or different and are each unsubstituted lower alkyl or hydroxyl- and/or carboxyl-substituted lower alkyl, and at least one of R.sub.1, R.sub.2, R.sub.3 and R.sub.4 is hydroxyl-substituted lower alkyl, and hydroxyalkyl-substituted diethylenetriamines represented by the formula ##STR2## wherein R.sub.5, R.sub.6, R.sub.7 and R.sub.8 are the same or different and are each unsubstituted lower alkyl or hydroxyl-and/or carboxyl substituted lower alkyl, R.sub.9 is hydrogen or unsubstituted lower alkyl or hydroxyl-and/or carboxyl-substituted lower alkyl, and at least one of R.sub.5, R.sub.6, R.sub.7, R.sub.8 and R.sub.9 is hydroxyl-substituted lower alkyl.

REFERENCES:
patent: 2938805 (1960-05-01), Agens
patent: 3347724 (1967-10-01), Schneble et al.
patent: 3615733 (1971-10-01), Shipley et al.
patent: 3635758 (1972-01-01), Schneble et al.
patent: 3650777 (1972-03-01), Schneble et al.
patent: 3770464 (1973-11-01), Dutkewych et al.
patent: 3959531 (1976-05-01), Schneble et al.

Affiliated with

Also associated with

Rating

Compositions for chemical copper plating does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Compositions for chemical copper plating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Compositions for chemical copper plating will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-889889