Compositions and processes for treating subterranean formations

Details Compositions and processes for treating subterranean formations Compositions and processes for treating subterranean formations

1996-10-03

1999-07-13

Kelly, C. H.

Earth boring, well treating, and oil field chemistry

Well treating

Contains organic component

526263, 526277, 526287, 526310, 526291, 507130, 166308, C09K 300, C09K 700, E21B 4317, C08F 2608

Patent

active

059226536

ABSTRACT:
A composition and a process for using the composition for applications in a subterranean formation are provided. The composition comprises a clay, a polymer, and a liquid. The polymer comprises repeat units derived from a nitrogen-containing olefinic monomer and optionally an olefinic comonomer. The composition can be used as or in drilling fluids, workover fluids, completion fluids, or combinations of any two or more thereof.

REFERENCES:
patent: 4317487 (1982-03-01), Merkl
patent: 4454114 (1984-06-01), Strasilla et al.
patent: 4460570 (1984-07-01), Strasilla et al.
patent: 4507440 (1985-03-01), Engelhardt et al.
patent: 4609476 (1986-09-01), Heilweil
patent: 4661266 (1987-04-01), Kanda et al.
patent: 4848570 (1989-07-01), Korpics
patent: 4928766 (1990-05-01), Hoskin
patent: 5003016 (1991-03-01), Boeder
patent: 5028344 (1991-07-01), Hoskin
patent: 5129457 (1992-07-01), Sydansk
patent: 5270382 (1993-12-01), Ahmed et al.
patent: 5294691 (1994-03-01), Ahmed et al.
patent: 5391669 (1995-02-01), Sulc et al.
patent: 5650633 (1997-07-01), Ahmed et al.
Macromolecules, 1994, 27, 2165-2173.

Affiliated with

Also associated with

Rating

Compositions and processes for treating subterranean formations does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Compositions and processes for treating subterranean formations, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Compositions and processes for treating subterranean formations will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2275602