Compositions and methods for polishing and planarizing surfaces

Abrasive tool making process – material – or composition – With inorganic material – Clay – silica – or silicate

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51293, 51309, 106 3, 106 6, C09C 168

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active

052640108

ABSTRACT:
An abrasive composition for use in polishing or planarizing the surface of a work piece is provided comprising about 30 to 50 percent of cerium oxide; about 8 to about 20 percent of fumed silica and about 15 to about 45 percent of precipitated silica. Methods using the composition to polish or planarize the surfaces of work pieces, as well as products produced by such methods, are also provided.

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Peter A. Burke, "Semi-Empirical Modelling of SiO.sub.2 Chemical-Mechanical Polishing Planarization", Jun. 11-12, 1991, VMIC Conference, pp. 379-384.
Ronald R. Uttecht and Robert M. Geffken, "A Four-Level-Metal Fully Planarized Interconnect Technology For Dense High Performance Logic and SRAM Applications", Jun. 11-12, 1991, VMIC Conference, pp. 20-26.

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