Compositions and methods for drying patterned wafers during...

Cleaning and liquid contact with solids – Processes – With treating fluid motion

Reexamination Certificate

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Details

C134S036000, C134S002000, C134S022190, C252S194000, C252S184000, C252S364000, C510S175000, C510S407000

Reexamination Certificate

active

07011716

ABSTRACT:
Drying of patterned wafers is achieved in a manner effecting removal of water from the patterned wafers without collapse or deterioration of the pattern structures thereof. The drying is carried out in one aspect of the invention with a composition containing supercritical fluid, and at least one water-reactive agent that chemically reacts with water to form reaction product(s) more soluble in the supercritical fluid than water. Various methodologies are described for use of supercritical fluids to dry patterned wafers, which avoid the (low water solubility) deficiency of supercritical fluids such as supercritical CO2.

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