Abrasive tool making process – material – or composition – With inorganic material
Reexamination Certificate
2011-04-26
2011-04-26
Deo, Duy-Vu N (Department: 1713)
Abrasive tool making process, material, or composition
With inorganic material
C051S308000, C051S309000
Reexamination Certificate
active
07931714
ABSTRACT:
A chemical mechanical polishing composition, the polishing composition includes polishing abrasive, an oxidizing agent, an accelerating compound, an inhibitor, a co-inhibitor, and a solvent as the remaining. The composition can maintain a high removal rate through polishing, meantime it has a feature to inhibit static etch rate and lower the defect of polishing including metal dishing and erosion. Hence it needs no change of the composition for simultaneously removing a most part of a metal layer, particularly for a first stage of polishing bulk copper layer and for a second micro-polishing stage of removing the remaining less copper; the present invention has the advantage of simplifying processing and reducing waste.
REFERENCES:
patent: 6248144 (2001-06-01), Tamai et al.
patent: 7319072 (2008-01-01), Kurata et al.
patent: 2003/0219982 (2003-11-01), Kurata et al.
patent: 2004/0020135 (2004-02-01), Tsuchiya et al.
Deo Duy-Vu N
Jianq Chyun IP Office
UWIZ Technology Co., Ltd.
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