Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Patent
1989-07-31
1991-05-14
Lieberman, Allan M.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Processes of preparing a desired or intentional composition...
523436, 523427, 523428, 523433, 525476, 525487, 525502, 525530, C08L 6302, C08L 6304, C08L 6310
Patent
active
050156748
ABSTRACT:
A resin composition for sealing semiconductors which comprises (a) an epoxy resin, (b) a hardening agent, (c) an inorganic filler and (d) a polymaleimide having a specific structure is herein provided. Preferably, the resin composition comprises, as all of or a part of the epoxy resin, a modified epoxy resin composed of (i) a graft polymer of an epoxy resin and a vinyl polymer and (ii) a silicone polymer in an oily state or as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the graft polymer. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption. Therefore, if the composition is used to seal semiconductor devices on a large scale having degree of integration or small-sized, thin semiconductors such as flat packages, these semiconductors provide high reliability.
REFERENCES:
patent: 3577263 (1971-05-01), Nordstrom
patent: 4510272 (1985-04-01), Loszewski
patent: 4707529 (1987-11-01), Hoffmann et al.
patent: 4831102 (1989-05-01), Yamaya et al.
patent: 4904761 (1990-02-01), Okitsu et al.
Asahina Koutarou
Kitahara Mikio
Kubo Takayuki
Machida Koichi
Torikai Motoyuki
Lieberman Allan M.
Mitsui Toatsu Chemicals Inc.
Sellers II Robert E. L.
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