Composition of polyepoxy compounds, linear polymer and aromatic

Details Composition of polyepoxy compounds, linear polymer and aromatic Composition of polyepoxy compounds, linear polymer and aromatic

1989-07-13

1992-02-25

Marquis, Melvyn I.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525438, 525524, 525527, C08L 6302, C08L 6307, C08L 6702, C08L 7908

Patent

active

050914812

ABSTRACT:
A resin composition for laminate, which comprises 100 parts by weight of a composition (B), from 0.5 to 10 parts by weight of dicyandiamide and from 1 to 100 parts by weight of a linear polymer, said composition (B) comprising (i) a composition (A) comprising from 20 to 80 parts by weight of a polyfunctional epoxy compound of the formula: ##STR1## wherein R is H or CH.sub.3 and n is an integer of from 0 to 5, and from 80 to 20 parts by weight of an epoxy compound having two epoxy groups in one molecule, and (ii) an aromatic diamino compound incorporated in the composition (A) in such an amount that its active hydrogen is from 0.3 to 0.8 equivalent per equivalent of terminal epoxy groups.

REFERENCES:
patent: 4390664 (1983-06-01), Kanayama
patent: 4593056 (1986-06-01), Qureshi et al.
patent: 4623701 (1986-11-01), Massingill
patent: 4645803 (1987-02-01), Kohli et al.
patent: 4912179 (1990-03-01), Murakami et al.
SAMPE Journal Jul./Aug. 1985, "Semi-2-Interpenetrating Polymer Networks of High Temperature Systems", Hanky et al., pp. 40-45.
Database WPIL, accession No. 87-295539, Derwent Publications Ltd., London, GB.** (Abstract of JP 62-207 322, of record).

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