Composition of polyepoxide and phosphorous-containing polyepoxid

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

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525486, 525525, 525526, C08K 554, C08L 6302, C08L 6304

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active

053648935

ABSTRACT:
The invention provides epoxide resin molding compositions for protectively covering semiconductor components, which are accessible in a cost-effective manner and have good processibility. The epoxide resin molding compositions provide virtually inflammable molded materials with a high glass transition temperature and a low thermal expansion coefficient without the addition of flameproofing agents, when they contain the following constituents:

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patent: 4713137 (1987-12-01), Sexton
patent: 4812490 (1989-03-01), Kleeberg et al.
Hoeschst AG, "Phosphorus-containing epoxide resins", Chemical abstracts, abstract No. 77:16697y, 1977.
Abstract of Japanese Patent No. 51-143620 published Dec. 10, 1976.
The Condensed Chemical Dictionary, Eighth Edition, Van Nostrand Reinhold Co., New York, N.Y., 1971, p. 230.
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"Chemical Abstracts", vol. 91, No. 6, abstract No. 40180u, (Aug. 6, 1979), p. 22.
"Chemical Abstracts", vol. 99, No. 26, abstract No. 213394n, (Dec. 26, 1983), p. 34.
"Chemical Abstracts", vol. 106, No. 18, abstract No. 139155e, (May 4, 1987), p. 29.

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