Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Reexamination Certificate
2006-04-25
2008-10-28
Sellers, Robert (Department: 1796)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Processes of preparing a desired or intentional composition...
C257S793000, C525S481000, C525S523000
Reexamination Certificate
active
07442729
ABSTRACT:
A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. The epoxy resin composition includes a compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, trisubstituted phosphoniophenolate or a salt thereof as a curing accelerator (C), and an inorganic filler (D).
REFERENCES:
patent: 3674854 (1972-07-01), Starnes, Jr.
patent: 4171420 (1979-10-01), Doorakian et al.
patent: 4302574 (1981-11-01), Doorakian et al.
patent: 4395574 (1983-07-01), Doorakian et al.
patent: 4477645 (1984-10-01), Doorakian et al.
patent: 4540823 (1985-09-01), Doorakian et al.
patent: 4939112 (1990-07-01), Bennett
patent: 6306792 (2001-10-01), Miyake et al.
patent: 6664344 (2003-12-01), Oki et al.
patent: 2001/0037003 (2001-11-01), Miyake et al.
patent: 0 019 852 (1980-12-01), None
patent: 0 362 854 (1990-04-01), None
patent: 1 130 041 (2001-09-01), None
patent: 10-025335 (1998-01-01), None
patent: 2001-098053 (2001-04-01), None
patent: 2001-98053 (2001-04-01), None
Bestmann, H.J., et al., “Eine neue Variante der Smiles-Umlagerung”, Liebigs Ann Chem., vol. 716, 1968, pp. 98-101, XP009016787.
Akiyama Yoshihito
Goh Yoshiyuki
Hirose Hiroshi
Nonaka Hirotaka
Okubo Akiko
Sellers Robert
Smith , Gambrell & Russell, LLP
Sumitomo Baeklite Company Limited
LandOfFree
Composition of epoxy resin, polyphenolic compound and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Composition of epoxy resin, polyphenolic compound and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composition of epoxy resin, polyphenolic compound and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4012584