Composition of epoxy resin, OH-terminated phosphonate...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C523S457000, C525S485000, C525S523000

Reexamination Certificate

active

07427652

ABSTRACT:
An epoxy resin composition is disclosed that comprises an epoxy resin, a reactive phosphonate curing agent, an inorganic filler, whose presence allows for reduced amounts of phosphonate as compared to a composition not containing the filler, an optional polybenzoxazine resin, and an optional co-curing agent.

REFERENCES:
patent: 2682522 (1954-06-01), Coover, Jr. et al.
patent: 2716101 (1955-08-01), Coover, Jr. et al.
patent: 4268633 (1981-05-01), Fearing
patent: 4331614 (1982-05-01), Schmidt et al.
patent: 4415719 (1983-11-01), Schmidt et al.
patent: 4719279 (1988-01-01), Kauth et al.
patent: 4970249 (1990-11-01), Joswig et al.
patent: 5945222 (1999-08-01), Nagase et al.
patent: 6005064 (1999-12-01), Hirai et al.
patent: 6214455 (2001-04-01), Honda et al.
patent: 2005/0020800 (2005-01-01), Levchik et al.
patent: 1335680 (1995-05-01), None
patent: 3139958 (1983-04-01), None
patent: 0451101 (1991-10-01), None
patent: 1 116 774 (2001-07-01), None
patent: 1438381 (1966-04-01), None
patent: 2348197 (1977-12-01), None
patent: 1308521 (1973-02-01), None
patent: 08-183835 (1996-07-01), None
patent: 2000-256633 (2000-09-01), None
patent: 2001-19746 (2001-01-01), None
patent: 2001-302879 (2001-10-01), None
patent: 2002088138 (2002-03-01), None
patent: 99/00451 (1999-01-01), None
patent: 01/74960 (2001-10-01), None
patent: 02/055 603 (2002-07-01), None
patent: 02/072655 (2002-09-01), None
patent: 03/029 258 (2003-04-01), None
patent: 03/029258 (2003-04-01), None
Database WPI Section Ch, Week 200143, Derwent Publications Ltd., London, 6B; Class A21, An2001-400810 XP002274895 & JP2001-019746, Jan. 23, 2001.
Database WPI Section Ch, Week 200230, Derwent Publications Ltd., London, 6B; Class A21, An2002-246988, XP002274896 & JP2001-302879, Oct. 31, 2001.
Database WPI Section Ch, Week 200105, Derwent Publications Ltd., London, GB; Class A21, An2001-034272, XP002274897 & JP2000-226499, Aug. 15, 2000.
Takeda et al., “Environment-Friendly, Halogen-Free Material for PCBs,” pp. S11-4-1- to S11-4-5, Presented at IPC Printed Circuits Expo® 2001.
Liu et al., “Flame-Retardant Epoxy Resin from o-Cresol Novolac Epoxy Cured with a Phosphorus-Containing Aralkyl Novolac”; Journal of Polymer Science, Part A: Polymer Chemistry vol. 40,2329-2339(2002).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Composition of epoxy resin, OH-terminated phosphonate... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Composition of epoxy resin, OH-terminated phosphonate..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composition of epoxy resin, OH-terminated phosphonate... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3966499

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.