Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Reexamination Certificate
2001-02-15
2003-02-04
Sellers, Robert E.L. (Department: 1712)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Processes of preparing a desired or intentional composition...
C525S481000, C525S486000, C525S490000, C528S163000
Reexamination Certificate
active
06515047
ABSTRACT:
1. FIELD OF THE INVENTION
The present invention relates to a thermosetting resin composition for providing a cured product which has excellent heat resistance and electric properties and which is useful as a laminated board, encapsulating material, adhesive, coating or electric insulating material.
2. BACKGROUND OF THE INVENTION
An epoxy resin is used in various fields since it has excellent heat resistance, adhesion, water resistance, mechanical strength and electric properties. The epoxy resin used is generally a diglycidyl ether of bisphenol A or phenol or cresol novolak type epoxy resin or the like.
However, as the above epoxy resin alone has no flame retardancy, it is often used in conjunction with a halogen-based flame retardant, antimony trioxide or aluminum hydroxide or the like for application in electric and electronic material parts which require high flame retardancy.
However, a halogen-based flame retardant is apprehended as one of the sources of a dioxine which has become a social problem, antimony trioxide has problems such as toxicity and a decrease in insulating properties, and aluminum hydroxide involves such a problem that when it is blended in large quantities, electric properties decrease. Therefore, a flame retardant comprising another compound which can replace these substances or reduce the amounts of these substances is proposed. Or, where flame retarding formulation is strongly desired, there are proposed a method of adding a phosphorus-based compound flame retardant (Japanese Patent Application Laid-open Nos. 11-124489 and 11-166035) and a method of using a compound having a triazine ring (Japanese Laid-open Patent Application Nos. 03-62825 and 08-253557).
However, the addition of a phosphorus-based compound has such a demerit that basic properties such as heat resistance and humidity resistance are lost because a phosphorus-based compound must be used in large quantities to provide sufficient flame retardancy.
The method of using a compound having a triazine ring is advantageous from an environmental point of view because it is a nitrogen compound but has a problem with the effect of improving the flame retardancy of an epoxy cured product because only a small amount of the triazine ring can be introduced into the molecule.
The present invention is to provide a thermosetting resin composition which can provide a cured product having excellent flame retardancy without impairing the heat resistance of an epoxy cured product and contains an epoxy resin and a specific phenol resin curing agent having a triazine ring.
The inventors of the present invention have conducted intensive studies on a compound having a triazine ring and have found that a cured product having an excellent effect of improving flame retardancy can be obtained from a specific phenol resin having at least one triazine ring in the molecule without impairing the performance of an epoxy resin.
3. SUMMARY OF THE INVENTION
Accordingly the present invention relates to:
A thermosetting resin composition comprising the following components (A) and (B):
component (A): an epoxy resin, and
component (B): a phenol resin containing a phenol compound represented by the following general formula (1):
wherein R
1
and R
2
are a hydrogen atom or alkyl group having 1 to 4 carbon atoms, R
3
is an amino group, alkyl group having 1 to 4 carbon atoms, phenyl group, vinyl group or any one of the following general formula (2)
and general formula 3:
[wherein R
1
and R
2
in the general formulae (2) and (3) are a hydrogen atom or alkyl group having 1 to 4 carbon atoms, and m is an integer of 1 or 2.]
A preferred embodiment of said thermosetting resin composition is that one, wherein the hydroxyl group of the phenol resin as the component (B) is contained in an amount of 0.1 to 2 equivalents based on 1 equivalent of the epoxy group of the epoxy resin as the component (A).
In a more preferred thermosetting resin composition the component (B) is a phenol resin containing a phenol compound represented by the above general formula (1) in an amount of 10 to 90 wt %.
In a further preferred thermosetting resin composition, the component (B) is a phenol resin containing a phenol compound represented by the following general formula(e) (4) and/or (5)
[wherein R
1
and R
2
are a hydrogen atom or alkyl group having 1 to 4 carbon atoms, R
3
is an amino group, alkyl group having 1 to 4 carbon atoms, phenyl group, vinyl group or any one of the above general formulae (2) and (3), and m is an integer of 1 or 2,] and n is an integer of 0 to 20, in addition to the phenol compound represented by the above general formula (1).
In a further preferred thermosetting resin compound the component (B) is a phenol resin containing a phenol compound represented by the herein before depicted general formula (4) in an amount of 1 to 45 wt % and/or a phenol resin containing a phenol compound represented by the herein before depicted general formula (5) in an amount of 10 to 80 wt %.
In the most preferred thermosetting resin composition the component (B) is a phenol resin produced by reacting a methylol product of a triazine compound with phenols.
In an other preferred thermosetting resin composition, wherein a curing accelerator is contained in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of the epoxy resin.
In a more preferred thermosetting resin composition, the curing accelerator is a compound selected from the group consisting of tertiary amines, imidazoles and organic phosphines.
Preferred thermosetting resin compositions are comprising a metal hydroxide in an amount of 1 to 50 parts by weight based on 100 parts by weight of the hereinbefore specified epoxy.
More preferablely in the thermosetting resin composition the metal hydroxide is a compound selected from the group consisting of aluminum hydroxide and magnesium hydroxide.
The hereinbefore specified thermosetting resin composition is used for laminated boards, encapsulating materials or powder coatings
4. DETAILED DESCRIPTION OF THE INVENTION
Component (A): epoxy resin
The epoxy resin as the component (A) used in the present invention is a general epoxy resin. Examples of the epoxy resin include:
(1) Aromatic Diglycidyl Ethers;
diglycidyl ethers of bisphenol A, diglycidyl ethers of bisphenol F, diglycidyl ethers of 3,3′, 5,5′-tetramethylbisphenol A, diglycidyl ethers of 3,3′, 5,5′-tetramethylbisphenol F, diglycidyl ethers of bisphenol S, diglycidyl ethers of dihydroxyphenyl, diglycidyl ethers of biphenols, diglycidyl ethers of 3,3′, 5,5′-tetramethylbiphenol, diglycidyl ethers of naphthalene diol, etc.
(2) Polyfunctional Epoxies;
phenol novolak type epoxy resins, cresol novolak type epoxy resins, naphthol novolak type epoxy resins, bisphenol A novolak type epoxy resins, epoxy resins obtained from triphenol methane, epoxy resins obtained from tetraphenol ethane, etc.
(3) Others;
glycidyl esters obtained from phthalic acid, hexahydrophthalic acid, dimer acid and the like, glycidylamines obtained from aminophenol, diaminodiphenyl methane and the like, aliphatic epoxies obtained from 1,4-butanediol, 1,6-hexanediol and the like, alicyclic epoxies obtained from cyclohexane dimethanol, hydrogenated bisphenol A and the like, alicyclic aliphatic epoxies obtained from a cycloolefin such as 3,4-epoxycyclohexylmethyl-3′, 4′-epoxycyclohexane carboxylate and peracetic acid, and epoxy resins obtained from a condensation reaction of one or more of the above aromatic diglycidyl ethers, polyfunctional epoxies and others with bisphenols (bisphenol A, bisphenol F, bisphenol S, dihydroxydiphenyl ethers, biphenols, 3,3′, 5,5′-tetramethylbiphenol, naphthalene diol and the like).
Component (B): Phenol Resin
The phenol resin as the component (B) used in the present invention functions as a curing agent for the epoxy resin as the component (A) and contains a phenol compound represented by the following general formula (1),
having at least one triazine ring in one molecule, [wherein R
1
a
Fukuzawa Takao
Hirai Takayoshi
Imura Tetsuro
Ohnuma Yoshinobu
Jones Lisa Kimes
Resolution Performance Products
Sellers Robert E.L.
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