Compositions: coating or plastic – Coating or plastic compositions – Metal-depositing composition or substrate-sensitizing...
Patent
1986-06-06
1990-01-02
Niebling, John F.
Compositions: coating or plastic
Coating or plastic compositions
Metal-depositing composition or substrate-sensitizing...
106 112, 106 113, 106 122, 204 30, 204 384, 502100, C23C 3000
Patent
active
048910694
ABSTRACT:
A process and composition are disclosed for directly electrometallizing a non-conductive substrate such as the non conductive surfaces of a circuit board and to directly effect through hole plating and/or form circuits on the boards without employing an electroless metal coating.
A process and composition is also described for depositing metals on a non-conductive substrate by using the reductive capacity of hydrogen in the presence of a metal catalyst on the substrate. The metal catalyst is combined with hydrogen that is generated electrolytically from a protic bath. The metal catalyst combined with hydrogen is contacted with a metal salt. The metal salt may be combined with the protic bath so that the hydrogen that is generated electrolytically combines with the metal catalyst and the metal salt is converted to a metal coating on the substrate.
REFERENCES:
patent: 3099608 (1963-07-01), Radovsky et al.
patent: 3303111 (1967-02-01), Peach
patent: 3930963 (1976-01-01), Polichette
"Electroplating", F. H. Lowenheim, McGraw Hill, 1977, pp. 422-423.
IPC TP 582 Technical Paper Eliminate Electroless Copper Baths in Conventional Through Holes Plating Lines--Author-Blurton, Zebliski & Wohlgemuth--presented I.P.C. 29th annual meeting, Apr. 6-10, 1986, Boston, Mass.
Holtzman Abrahm M.
Relis Joseph
Niebling John F.
Ryser David G.
Techno Instruments Investments 1983 Ltd.
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