Composition for stripping lead-tin solder

Details Composition for stripping lead-tin solder Composition for stripping lead-tin solder

1975-10-24

1976-11-09

Powell, William A.

Compositions

Etching or brightening compositions

Inorganic acid containing

156 3, 156 11, 156 13, 156 18, 174 685, 252 794, 427 96, C23F 102

Patent

active

039909824

ABSTRACT:
A method for rapidly stripping solder or tin from a substrate, such as copper, without adversely affecting the substrate in the preparation of circuit boards having terminal tabs. The composition comprises hydrofluoric acid or salts thereof, ammonia and an oxygen source such as hydrogen peroxide. The use of a soluble metal complexer peroxide stabilizer enables use of larger percentages of fluoride and peroxide to materially increase the life and capacity of the product. The composition is especially useful in a process of rapidly stripping solder from copper terminal tabs of a printed circuit board, following which the exposed copper tab is plated with a more noble metal.

REFERENCES:
patent: 3158517 (1964-11-01), Schwarzenberger
patent: 3537926 (1970-11-01), Fischer
patent: 3677949 (1972-07-01), Brindisi et al.

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