Composition for sensitizing articles for metallization

Details Composition for sensitizing articles for metallization Composition for sensitizing articles for metallization

1978-02-21

1981-03-31

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

427304, 427306, C23C 300

Patent

active

042591139

ABSTRACT:
Surfaces of articles are sensitized for the deposition of adherent metal from electroless metal solutions in contact therewith by prior treatment with a liquid containing an activatable complex of copper. The copper-containing complexes of the instant invention are the product of forming solutions comprising a halogen component, a cuprous component and a cupric component. The solutions may optionally be in contact with elemental metal.

REFERENCES:
patent: 2049402 (1936-07-01), Wernlund
patent: 2472393 (1949-06-01), Ajallone et al.
patent: 3141780 (1964-07-01), Simon et al.
patent: 3617340 (1971-11-01), Thielen
patent: 3682671 (1972-08-01), Zeblisky
patent: 3778360 (1973-12-01), Gordy
patent: 3793037 (1974-02-01), Hacias
patent: 3798026 (1974-03-01), Milner et al.
patent: 4020197 (1977-04-01), Steffen
Gould, Inorg. Reactions & Structures, 1955, p. 165.

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