Composition for polishing pad and polishing pad using the same

Details Composition for polishing pad and polishing pad using the same Composition for polishing pad and polishing pad using the same

2006-07-18

2006-07-18

Woodward, Ana (Department: 1711)

Abrasive tool making process, material, or composition

With synthetic resin

C051S299000, C051S300000, C051S301000, C051S302000, C051S307000, C451S526000, C523S201000, C525S063000, C525S054300, C525S054310, C525S054420, C525S070000

Reexamination Certificate

active

07077879

ABSTRACT:
An object of the invention is to provide a polishing pad having the excellent slurry retaining properties and the large removal rate and a composition for a polishing pad which can form such the polishing pad. A composition for polishing pad of the invention is comprising a water-insoluble matrix material containing a crosslinked polymer and a water-soluble particle dispersed in the water-insoluble matrix material. The elongation remaining after breaking is 100% or less when a test piece comprising the water-insoluble matrix material is broken at 80° C. according to JIS K 6251. A polishing pad of the invention is that at least a part of the polishing pad comprises the composition for polishing pad.

REFERENCES:
patent: 2701191 (1955-02-01), Laliberte
patent: 5523331 (1996-06-01), Ezoe
patent: 6080221 (2000-06-01), Moore
patent: 6245861 (2001-06-01), Class
patent: 6645264 (2003-11-01), Hasegawa et al.
patent: 6855034 (2005-02-01), Hasegawa
patent: 8-500622 (1996-01-01), None
patent: 2000-33552 (2000-02-01), None
patent: 2000-34416 (2000-02-01), None
patent: WO 94/04599 (1994-03-01), None
Patent Abstracts of Japan, JP 61-11133, May 29, 1986.
Derwent Abstract, AN 1992-019219, jp 3-266706, Nov. 27, 1991.

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