Radiation imagery chemistry: process – composition – or product th – Imaged product – Including resin or synthetic polymer
Patent
1992-11-13
1995-08-08
Schofer, Joseph L.
Radiation imagery chemistry: process, composition, or product th
Imaged product
Including resin or synthetic polymer
430270, 430271, 430272, 430280, 522 31, 522170, 523401, 523444, G03C 1725
Patent
active
054397669
ABSTRACT:
According to the present invention, good image resolution of a cationically polymerized epoxy based coating, such as a solder mask or dielectric or etch resist, is provided by combining a cationically polymerized epoxy based coating with conventional epoxy glass substrates cured with a curing agent that does not produce basic reaction products. Preferably, the coating is photoimagable. The method for making the same is also provided. The coating material includes an epoxy resin system comprising between from about 10% to about 90%, preferably about 28% to about 57% by weight of a polyol epoxy resin, and from about 10% to about 90%, preferably about 43% to 72% by weight, of a brominated epoxy resin. Optionally, a polyepoxy resin or an epoxy creosol novolak resin is added to the resin system. The polyepoxy resin may be added from an effective amount up to less than 90% of the resin system; the epoxy creosol novolak may be added from an effective amount up to about 80 pph.
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"Curing Agents and Modifiers," Epoxy Resins, Chemistry and Technology, Second Edition, by Clayton A. May Hi-Tek Polymers, CMD W55-5003 Epoxy Resin Dispersion, Oct. 1988.
Day Richard A.
Glatzel Donald H.
Mertz John R.
Roth Joel L.
Russell David J.
Cooney Jr. John M.
International Business Machines - Corporation
Schofer Joseph L.
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