Metal treatment – Barrier layer stock material – p-n type
Patent
1996-07-08
1997-09-16
Nguyen, Tuan H.
Metal treatment
Barrier layer stock material, p-n type
438798, H01L 21265
Patent
active
056680236
ABSTRACT:
Nonpolar substrates comprising off-axis growth regions for the growth of polar semiconductors, and a method for making such substrates, are disclosed. According to the invention, an erodible material, such as a photoresist, is applied to a substrate at a site and is exposed to radiation at that site which has an linear variation in energy at the surface of the erodible material. Due to this variation in exposure energy, a taper results in the erodible material after development. The tapered region is then etched in a manner which etches both the erodible layer and the underlying substrate. The taper in the erodible layer provides a varying attenuation during the etching process such that the taper of the erodible layer is transferred to the substrate.
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Goossen Keith Wayne
Walker James A.
Lucent Technologies - Inc.
Nguyen Tuan H.
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