Composition for multilayer printed wiring board

Details Composition for multilayer printed wiring board Composition for multilayer printed wiring board

1985-04-11

1986-06-03

Bell, Mark L.

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

501 66, 501 77, C03C 1400, C03C 3091, C03C 3064

Patent

active

045930066

ABSTRACT:
A composition for a multilayer printed wiring board, consisting essentially of from 25 to 65% by weight of glass powder, from 0 to 60% by weight of alumina powder and from 5 to 60% by weight of forsterite powder, said glass powder consisting essentially of from 25 to 70% by weight of SiO.sub.2, from 4 to 15% by weight of Al.sub.2 O.sub.3, from 25 to 45% by weight of B.sub.2 O.sub.3 and from 0.5 to 30% by weight of BaO.

REFERENCES:
patent: 4039338 (1977-08-01), Swiss et al.
patent: 4153491 (1979-08-01), Swiss et al.
patent: 4547625 (1985-10-01), Tosaku et al.

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