Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Composite having voids in a component
Reexamination Certificate
2008-03-11
2008-03-11
Kopec, Mark (Department: 1751)
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Composite having voids in a component
C428S442000, C428S447000, C252S500000, C252S511000, C427S387000, C427S226000, C257S758000, C438S637000, C521S064000, C521S154000
Reexamination Certificate
active
10706861
ABSTRACT:
Provided are a composition for forming film which can form a porous film excelling in dielectric constant, adhesiveness, uniformity of the film, mechanical strength and having low hygroscopicity; a porous film and a method for forming the film; and a high-performing and highly reliable semiconductor device comprising the porous film inside. More specifically, provided is a composition for forming porous film, comprisinga surfactant anda solution comprising polymer obtainable by hydrolyzing and condensing, in the presence of the surfactant, one or more of alkoxysilane represented by Formula (1) and one or more of alkoxysilane represented by Formula (2):in-line-formulae description="In-line Formulae" end="lead"?(R1)mSi(OR2)4-m (1)in-line-formulae description="In-line Formulae" end="tail"?in-line-formulae description="In-line Formulae" end="lead"?R3Si(R4)n(OR5)3-n (2)in-line-formulae description="In-line Formulae" end="tail"?Also provided is a method for forming porous film comprising a step of applying said composition on a substrate to form film and a step of transforming the film into porous film.
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Hamada Yoshitaka
Nakagawa Hideo
Sasago Masaru
Yagihashi Fujio
Alston & Bird LLP
Kopec Mark
Matsushita Electric - Industrial Co., Ltd.
Vijayakumar Kallambella
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