Composition for forming porous film, porous film and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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C528S010000

Reexamination Certificate

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06930393

ABSTRACT:
The object of the invention is to provide a porous film having the dielectric constant of 2.2 or less and having practicable mechanical strength. This invention provides a porous film-forming composition comprising (A) and (B):(A) 100 parts by weight of a hydrolyzable silicon compound and/or a product resulting from hydrolysis condensation of silicon compound expressed by following formula (1):in-line-formulae description="In-line Formulae" end="lead"?R1aSiZ14-a  (1)in-line-formulae description="In-line Formulae" end="tail"? wherein Z1denotes a hydrolyzable group; R1denotes a substituted or non-substituted monovalent hydrocarbon group; and a denotes an integer of 0 to 3; and(B) 0.1 to 20 parts by weight of a cross-linking agent comprising at least one cyclic oligomer which can generate silanol group(s) by heating and which is expressed by following formula (3):in-line-formulae description="In-line Formulae" end="lead"?{R31(H)SiO}d{R32(Z3)SiO}e  (3)in-line-formulae description="In-line Formulae" end="tail"? wherein R31and R32each denotes a substituted or non-substituted monovalent hydrocarbon group; Z3denotes a group which can generate silanol by heating; and each d and e denotes an integer of 0 to 10, and a sum of d and e is greater than or equal to three.

REFERENCES:
patent: 5494859 (1996-02-01), Kapoor
patent: 6197913 (2001-03-01), Zhong
patent: 6313045 (2001-11-01), Zhong et al.
patent: 6359096 (2002-03-01), Zhong et al.
patent: 6596404 (2003-07-01), Albaugh et al.
patent: 2000-44875 (2000-02-01), None
Inagaki et al., “Synthesis of Highly Ordered Mesoporous Materials from a Layered Polysilicate,” 1993, J.Chem. Soc. Chem. Commun., pp. 680-682.

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