Abrasive tool making process – material – or composition – With rubber or reaction product thereof
Reexamination Certificate
2001-10-23
2003-11-11
Dawson, Robert (Department: 1712)
Abrasive tool making process, material, or composition
With rubber or reaction product thereof
C428S542600, C451S548000, C051S302000
Reexamination Certificate
active
06645264
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to a composition for forming a polishing pad, a crosslinked body for a polishing pad, a polishing pad using the same and a method for producing thereof. The polishing pad in the invention is suitable for polishing of the surface of semiconductor wafer and the like.
DESCRIPTION OF THE RELATED ART
As a method for polishing which can form the surface having the high flatness, an attention has been recently paid to CMP (Chemical Mechanical Polishing). Polishing in CMP is accomplished by sliding the polishing pad against the polishing surface while allowing a slurry of abrasive particles in an aqueous dispersion to flow from the polishing pad surface.
In CMP, the removal rate is a major factor controlling productivity, and it is known that the removal rate can be vastly improved by increasing the retention of the slurry above the conventional level.
Polishing pads for CMP have conventionally been made of foamed polyurethane having pores formed to a size of a few tens of micrometers, and the use of polyurethane introduces the problem of durability of the pad because of its generally poor water resisting. On the other hand, when using an elastomer such as butadiene rubber which has excellent water resisting, the problem of low removal rate due to reduced moisture wettability is introduced.
SUMMARY OF THE INVENTION
It is an object of the present invention, which has been accomplished in light of these circumstances, to provide a composition for forming a polishing pad comprising substances having specific functional groups exhibiting excellent hydrophilic properties and the like, a crosslinked body for polishing pad as well as a polishing pad with excellent water resisting and durability which exhibits excellent polishing performance including a high removal rate and method for producing thereof.
The present invention will now be explained in detail.
1. A composition for forming a polishing pad comprising [A] a crosslinkable elastomer having no carboxyl, amino, hydroxyl, epoxy, sulfonic acid and phosphoric acid groups and [B] a water-insoluble substance having at least one functional group selected from the group consisting of carboxyl, amino, hydroxyl, epoxy, sulfonic acid and phosphoric acid groups.
2. The composition for forming a polishing pad according to 1 above, wherein the amount of [A] is 40 to 99.9 wt % and the amount of [B] is 0.1 to 60 wt %, based on 100 wt % of the total of [A] and [B].
3. The composition for forming a polishing pad according to 1 above, further comprising [C] a water-soluble substance.
4. The composition for forming a polishing pad according to 3 above, wherein the amount of [C] is 5 to 50 vol % based on 100 vol % of the total of [A], [B] and [C].
5. The composition for forming a polishing pad according to 4 above, wherein the above-mentioned crosslinkable elastomer is 1,2-polybutadiene.
6. The composition for forming a polishing pad according to 4 above, wherein [C] is cyclodextrin.
7. A crosslinked body for a polishing pad produced by using the composition for forming a polishing pad which is comprising [A] a crosslinkable elastomer having no carboxyl, amino, hydroxyl, epoxy, sulfonic acid and phosphoric acid groups and [B] a water-insoluble substance having at least one functional group selected from the group consisting of carboxyl, amino, hydroxyl, epoxy, sulfonic acid and phosphoric acid groups.
8. The crosslinked body for a polishing pad according to 7 above, further containing [C] a water-soluble substance in the above-mentioned composition for forming a polishing pad.
9. A polishing pad produced by using the composition for forming a polishing pad which is comprising [A] a crosslinkable elastomer having no carboxyl, amino, hydroxyl, epoxy, sulfonic acid and phosphoric acid groups and [B] a water-insoluble substance having at least one functional group selected from the group consisting of carboxyl, amino, hydroxyl, epoxy, sulfonic acid and phosphoric acid groups.
10. The polishing pad according to 9 above, wherein the amount of [A] is 40 to 99.9 wt % and the amount of [B] is 0.1 to 60 wt %, based on 100 wt % of the total of [A] and [B].
11. The polishing pad according to 10 above, wherein the above-mentioned crosslinkable elastomer is 1,2-polybutadiene.
12. The polishing pad according to 9 above, further containing [C] a water-soluble substance in the above-mentioned composition for forming a polishing pad.
13. The polishing pad according to 12 above, wherein the amount of [C] is 5 to 50 vol % based on 100 vol % of the total of [A], [B] and [C].
14. The polishing pad according to 13 above, wherein the above-mentioned crosslinkable elastomer is 1,2-polybutadiene.
15. The composition for forming a polishing pad according to 13 above, wherein [C] is cyclodextrin.
16. A method for producing a polishing pad comprising:
a first step for kneading a formulation (I) comprising [A] a crosslinkable elastomer having no carboxyl, amino, hydroxyl, epoxy, sulfonic acid and phosphoric acid groups and [B] a water-insoluble substance having at least one functional group selected from the group consisting of carboxyl, amino, hydroxyl, epoxy, sulfonic acid and phosphoric acid groups, and
a second step for molding into a polishing pad.
17. The method for producing a polishing pad according to 16 above, wherein the amount of [A] is 40 to 99.9 wt % and the amount of [B] is 0.1 to 60 wt %, based on 100 wt % of the total of [A] and [B].
18. The method for producing a polishing pad according to 17 above, further mixing the above-mentioned formulation (I) and [C] a water-soluble substance whose amount is 5 to 50 vol % based on 100 vol % of the total of [A], [B] and [C].
The polishing pad in the invention can be produced by using the composition for forming a polishing pad containing a substance having specific functional group. It exhibits satisfactory polishing performance and allows polishing surfaces to be polished with a high removal rate. The crosslinked body for a polishing pad in the invention is also useful for the aforementioned polishing pad.
DETAILED DESCRIPTION OF THE INVENTION
The composition for forming a polishing pad in the invention comprises [A] a crosslinkable elastomer having no carboxyl, amino, hydroxyl, epoxy, sulfonic acid and phosphoric acid groups and [B] a water-insoluble substance having at least one functional group selected from the group consisting of carboxyl, amino, hydroxyl, epoxy, sulfonic acid and phosphoric acid groups.
The “[A] crosslinkable elastomer” is not particularly limited, there may be mentioned diene-based elastomer such as 1,2-polybutadiene, butadiene rubber, isoprene rubber, acrylonitrile-butadiene rubber, styrene-butadiene rubber and styrene-isoprene rubber, ethylene-propylene rubber, acrylic rubber, silicone rubber, fluorine rubber, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ionomer and the like. These may be used alone or in combination of two or more.
As [A] described above, it is preferred to use a diene-based elastomer which can be easily crosslinked with organic peroxides. 1,2-polybutadiene is particularly preferred among diene-based elastomers above because it gives compositions with high hardness after crosslinking.
The “[B] water-insoluble substance” is not particularly restricted so long as it has at least one functional group from among carboxyl, amino, hydroxyl, epoxy, sulfonic acid and phosphoric acid groups and shows water-insoluble property. There may be used (1) inorganic particles of fumed silica or colloidal silica having the abovementioned functional groups, (2) modified polymers such as maleic anhydride-modified p
Hasegawa Kou
Kobayashi Yutaka
Koumura Tomoo
Aylward D.
JSR Corporation
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