Composition for forming photosensitive dielectric material,...

Details Composition for forming photosensitive dielectric material,... Composition for forming photosensitive dielectric material,...

2006-03-21

2006-03-21

McClendon, Sanza L. (Department: 1711)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

C522S071000, C522S096000, C522S100000, C522S104000, C522S150000, C522S152000, C522S153000, C522S154000, C522S157000, C522S160000, C522S067000, C522S065000, C522S062000, C522S046000, C522S164000, C252S570000, C252S572000, C252S578000, C430S170000, C430S189000, C430S193000, C430S197000, C430S194000

Reexamination Certificate

active

07015256

ABSTRACT:
A photosensitive composition for forming a dielectric of the present invention comprising inorganic particles, an alkali developable resin and additives, wherein the additives comprise a compound having a quinonediazido group (C1), a compound containing at least two alkyletherified amino groups in the molecule (C2) and a thermal acid generator (C3), or wherein the inorganic particles comprise inorganic superfine particles (A-I) having a mean particle diameter of less than 0.05 μm and inorganic fine particles (A-II) having a mean particle diameter of not less than 0.05 μm.The composition can be calcined at low temperatures to form a dielectric layer with high dimensional precision, said layer having a high dielectric constant and a low dielectric loss. Also provided are a dielectric and an electronic part prepared from the composition.

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