Composition for forming low dielectric constant insulating...

Details Composition for forming low dielectric constant insulating... Composition for forming low dielectric constant insulating...

2006-06-13

2006-06-13

Le, Hoa Van (Department: 1752)

Electricity: conductors and insulators

Insulators

Special application

C174S11900R, C174S13700R, C252S062000

Reexamination Certificate

active

07060909

ABSTRACT:
A composition for the formation of an insulating film comprising a low dielectric constant polymeric material and a sublimating material, which are dissolved in a solvent. Preferred low dielectric constant polymeric materials include polyaryl ethers. Preferred sublimating materials include silicone compounds having a closed stereostructure having atoms at its vertexes, such as those known as Si-T8 and Si-T12. A method of forming a low dielectric constant insulating film and electronic parts or components using an insulating film formed thereby are also disclosed.

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International Publication No. WO 00/61834, published Oct. 19, 2000.

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