Composition for forming high thermal conductivity polybenzoxazin

Details Composition for forming high thermal conductivity polybenzoxazin Composition for forming high thermal conductivity polybenzoxazin

1997-05-01

1999-05-04

Yoon, Tae

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524401, 524430, 524493, C08K 338

Patent

active

059004479

ABSTRACT:
The present invention relates to a composition and method for forming a high thermal conductivity polybenzoxazine-based material. The composition comprises at least one benzoxazine resin and a filler material which includes particles of boron nitride in an amount sufficient to establish a thermal conductivity of between about 3 W/mK and 37 W/mK in the polybenzoxazine-based material.

REFERENCES:
patent: 5021484 (1991-06-01), Schreiber et al.
patent: 5139885 (1992-08-01), Nakane et al.
patent: 5152939 (1992-10-01), Ishida

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