Composition for encapsulating signal transmission devices

Details Composition for encapsulating signal transmission devices Composition for encapsulating signal transmission devices

1997-08-08

1999-08-17

Wilson, Donald R.

Optical waveguides

Accessories

Plug/termination device

385128, 174 76, 428378, 525122, 528110, 528122, 5282955, G02B 624, B32B 1508, H02G 1504

Patent

active

059405708

ABSTRACT:
A method for encapsulating segments of signal transmission devices such as splices, pressure blocks and end blocks with a room-temperature curable composition comprising:
(1) a hydroxy-functional compound having a molecular weight of greater than 500 and a hydroxy functionality of 2 or more;
(2) an epoxy-functional compound having an epoxy functionality of 2 or more; and
(3) a curative catalyst, in an amount effective to crosslink the epoxy and hydroxy components of the respective epoxy-functional and hydroxy-functional compounds.

REFERENCES:
patent: 2633458 (1953-11-01), Shokal
patent: 2824083 (1958-02-01), Parry et al.
patent: 3281491 (1966-10-01), Smith et al.
patent: 3576781 (1971-04-01), Hicks
patent: 3897514 (1975-07-01), Allabashi
patent: 4156700 (1979-05-01), Tremblay et al.
patent: 5140069 (1992-08-01), Mulhaupt et al.
Lee et al., "Handbook of Epoxy Resins", McGraw-Hill Book Co., pp. 11/2-11/8 (Reissue 1982).

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