Composition for eliminating thermosetting resin

Details Composition for eliminating thermosetting resin Composition for eliminating thermosetting resin

2005-06-28

2005-06-28

Kornakov, M. (Department: 1746)

Cleaning and liquid contact with solids

Apparatus

With movable means to cause fluid motion

C134S084000, C134S088000, C134S198000, C134S061000, C015S021100, C015S038000, C015S039000, C510S188000, C510S206000, C510S504000, C510S506000

Reexamination Certificate

active

06910489

ABSTRACT:
An apparatus containing a composition suitable for eliminating a thermosetting resin is disclosed. In the composition, tetra methyl ammonium hydroxide (TMAH) is included so as to eliminate the thermosetting resin. Accordingly, the composition is suitable for removing a dielectric layer, an organic protective layer, an insulating layer, an alignment layer, black matrices and color filters, etc. made form a thermosetting resin in an LCD or a semiconductor, and permits a reproduction or a rework of the thermosetting resin film.

REFERENCES:
patent: 4645562 (1987-02-01), Liao et al.
patent: 5185235 (1993-02-01), Sato et al.
patent: 5292445 (1994-03-01), Fjare et al.
patent: 5582650 (1996-12-01), Simons
patent: 5779520 (1998-07-01), Hayakawa
patent: 5795702 (1998-08-01), Tanabe et al.
patent: 5855811 (1999-01-01), Grieger et al.
patent: 6017862 (2000-01-01), Doyel et al.
patent: 6060439 (2000-05-01), Doyel et al.
patent: 6277799 (2001-08-01), Sachdev et al.
patent: 6280527 (2001-08-01), Sachdev et al.
patent: 6351871 (2002-03-01), Sachdev et al.
patent: 6440326 (2002-08-01), Maruyama et al.
patent: 6468951 (2002-10-01), Grieger et al.
patent: 10-0254292 (2000-02-01), None

Affiliated with

Also associated with

Rating

Composition for eliminating thermosetting resin does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Composition for eliminating thermosetting resin, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composition for eliminating thermosetting resin will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3480305