Composition for electroplating palladium alloys and electroplati

Details Composition for electroplating palladium alloys and electroplati Composition for electroplating palladium alloys and electroplati

1997-11-19

1999-11-02

Mayekar, Kishor

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly alloy coating

205265, 106 127, 106 128, C25D 350

Patent

active

059763442

ABSTRACT:
An aqueous electroplating bath for the electrodeposition of palladium alloys in a mixed ligand system. A first ligand operates to form a complex of palladium and a second ligand functions to form a complex of another metal which brings the plating potentials of the two metals closer together. Palladium and the alloying metal thus exist as complexes with different structures.

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