Composition for coloring solder

Details Composition for coloring solder Composition for coloring solder

2009-05-06

2011-11-15

Webb, Gregory (Department: 1761)

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

C106S001260, C252S385000

Reexamination Certificate

active

08057587

ABSTRACT:
A method of coloring solder is provided. The method includes providing an aqueous coloring agent solution essentially containing 31-32% wt of copper sulfate, 64-65% wt of water and 3-4% wt of salt and an anti-caking agent, drying a solder seam with a dry cloth to remove excess flux, applying the aqueous coloring agent solution directly onto the solder seam; and wiping away excess amounts of the aqueous coloring agent solution with a second dry cloth.

REFERENCES:
patent: 2564756 (1951-08-01), Gessler
patent: 2915414 (1959-12-01), Hilemn
patent: 3930898 (1976-01-01), Cooley
patent: 4631093 (1986-12-01), Etemovich
patent: 4975159 (1990-12-01), Dahms
patent: 5160381 (1992-11-01), Gervias
patent: 5282890 (1994-02-01), Protzer et al.
patent: 5650014 (1997-07-01), Tauber
patent: 6712262 (2004-03-01), Akaike et al.
patent: 7393395 (2008-07-01), Aiba et al.
patent: 2002/0018844 (2002-02-01), Kitajima et al.
patent: 2008/0230263 (2008-09-01), En
patent: 2011/0042201 (2011-02-01), Von Gutfeld et al.
patent: 2011/0088932 (2011-04-01), Ebe

Affiliated with

Also associated with

Rating

Composition for coloring solder does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Composition for coloring solder, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composition for coloring solder will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4258582