Composition for circuit connection, method for connection using

Specialized metallurgical processes – compositions for use therei

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757 72, 757 67, 757 80, H01L 2314, H01L 2350, H01L 2354

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active

050015427

ABSTRACT:
A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particles size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.

REFERENCES:
patent: 4423435 (1983-12-01), Test, II
patent: 4654752 (1987-03-01), Kyle
patent: 4680226 (1987-07-01), Takeda
patent: 4731282 (1988-03-01), Tsukagoshi et al.
Bolger & Mooney, "Die Attah in Hi-Rel P-Dips: Polyimides or Low Chloride Epoxies?" IEEE Transactions on Components, Hybrids and Manufacturing Technology CHMT-7 (1984) Dec., No. 4, New York, U.S.A.

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