Specialized metallurgical processes – compositions for use therei
Patent
1989-11-30
1991-03-19
Hille, Rolf
Specialized metallurgical processes, compositions for use therei
757 72, 757 67, 757 80, H01L 2314, H01L 2350, H01L 2354
Patent
active
050015427
ABSTRACT:
A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particles size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.
REFERENCES:
patent: 4423435 (1983-12-01), Test, II
patent: 4654752 (1987-03-01), Kyle
patent: 4680226 (1987-07-01), Takeda
patent: 4731282 (1988-03-01), Tsukagoshi et al.
Bolger & Mooney, "Die Attah in Hi-Rel P-Dips: Polyimides or Low Chloride Epoxies?" IEEE Transactions on Components, Hybrids and Manufacturing Technology CHMT-7 (1984) Dec., No. 4, New York, U.S.A.
Goto Yasushi
Nakajima Atsuo
Tsukagoshi Isao
Yamaguchi Yutaka
Clark S. V.
Hille Rolf
Hitachi Chemical Company
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