Composition for circuit board manufacture

Etching a substrate: processes – Forming or treating electrical conductor article

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216 2, 216106, 216108, 252 792, 252 793, 134 2, 134 3, B05D 512

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060540613

ABSTRACT:
A process and composition for treating a metal surface to increase its surface roughness for subsequent adhesion to a polymer layer. The composition comprises hydrogen peroxide, inorganic acid, an amine free of a surfactant group and optionally, a corrosion inhibitor. The composition is characterized by elimination of a surfactant from solution.

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Derwent Info Ltd., Patent Abstract of Japanese Patent No. 51027819. Sep. 1974.
Derwent Info Ltd., Patent Abstract of Japanese Patent No. 3079778. Aug. 1989.
Derwent Info Ltd., Patent Abstract of Japanese Patent No. 6112646. Sep. 1992.

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