Composition containing cycloaliphatic epoxide, polyol...

Details Composition containing cycloaliphatic epoxide, polyol... Composition containing cycloaliphatic epoxide, polyol...

2005-12-09

2010-11-02

Sellers, Robert (Department: 1796)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C257S793000, C525S463000

Reexamination Certificate

active

07825197

ABSTRACT:
A liquid thermosetting epoxy resin composition contains a base resin in combination with a curing agent and a curing accelerator or with a curing catalyst. The base resin includes a cycloaliphatic epoxy compound having at least one alicyclic skeleton and two or more epoxy groups per molecule, and a polyol oligomer having two or more terminal hydroxyl groups. An optical semiconductor device includes an optical semiconductor element sealed by using the liquid thermosetting epoxy resin composition. The composition yields a cured resinous product which is free from curing failure, is optically homogenous, has a low elastic modulus in bending, a high bending strength, a high glass transition temperature, a high optical transparency and is useful for optical semiconductors.

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