Composition comprising epoxy resin, bismaleimide and barbituric

Details Composition comprising epoxy resin, bismaleimide and barbituric Composition comprising epoxy resin, bismaleimide and barbituric

1988-12-08

1991-08-20

Bleutge, John C.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From phenol, phenol ether, or inorganic phenolate

528170, 528322, 528102, C08G 5914, C08L 6310

Patent

active

050415190

ABSTRACT:
This invention relates to a resin composition which is used for the production of printed circuit boards. The feature of said resin composition is to add barbituric acid or its derivatives to a bismaleimide resin, and mixed in a solvent or solvent system. The mixture is then added with epoxy resin and suitable amount of curing agent to form the required resin composition. The resin composition has high glass transition temperature and good toughness and other physical and electrical properties. Meanwhile, it would not cause phase separation, so is a high-performance material for the production of printed circuit boards.

REFERENCES:
patent: 4107153 (1978-08-01), Akiyama et al.
patent: 4294877 (1981-10-01), Graham
patent: 4401777 (1983-08-01), Tsuboi et al.
patent: 4539392 (1985-09-01), Kadoi et al.

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