Composition comprising benzoxazine and epoxy resin

Details Composition comprising benzoxazine and epoxy resin Composition comprising benzoxazine and epoxy resin

2006-03-21

2011-11-22

Tucker, Philip (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C524S176000, C525S390000

Reexamination Certificate

active

08062455

ABSTRACT:
The instant invention relates to compositions comprising a benzoxazine resin and an advancement resin based on bisphenol A diglycidyl ether and bisphenol S and, optionally, ferrocene and aluminium trihydrate. Such compositions are, when cured to form polymeric networks, difficultly inflammable and resistant to high temperatures. Such compositions may especially be used in the production of printed wiring boards.

REFERENCES:
patent: 5019639 (1991-05-01), Hofer et al.
patent: 2002/0156189 (2002-10-01), Ogura et al.
patent: 2003/0094232 (2003-05-01), Saitou et al.
patent: 2003/0152776 (2003-08-01), Kiuchi et al.
patent: 2004/0166324 (2004-08-01), Mishima et al.
patent: 2004/0261660 (2004-12-01), Li et al.

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