Composition and slurry useful for metal CMP

Details Composition and slurry useful for metal CMP Composition and slurry useful for metal CMP

1997-07-11

2000-05-30

Gulakowski, Randy

Compositions

Etching or brightening compositions

216 88, 216 89, 438692, 438693, C09K 1300, C09G 102

Patent

active

060687878

ABSTRACT:
A chemical mechanical polishing precursor comprising at least one catalyst having multiple oxidation states, and at least one stabilizer, the composition being useful when admixed with an oxidizing agent prior to use to remove metal layers from a substrate.

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DuPont Oxone.RTM. Monopersulfate Compound, Oxone Monopersulfate Compound, pp. 1-6 (1994).
Analysis of MSW1000 Slurry (Oct. 27, 1995).
Cabot Corporation Semi-Sperse.TM. W-A355 Polishing Slurry for Tungsten CMP product literature.
Cabot Corporation Semi-Sperse.TM. FE-10 Oxidizer Solution for Tungsten CMP product literature.
Cabot Corporation General Information on Semi-Sperse.TM. W-A355 Polishing Slurry for Tungsten CMP product literature.
Patent Abstracts of Japan, publication No. 6342782, publication date Nov. 11, 1988.

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