Compositions: coating or plastic – Coating or plastic compositions – Corrosion inhibiting coating composition
Patent
1997-11-14
1999-07-20
Green, Anthony
Compositions: coating or plastic
Coating or plastic compositions
Corrosion inhibiting coating composition
148248, 148251, 148259, 148260, 148274, C23C 2205, C23C 2248, C23C 2252
Patent
active
059251743
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
This invention relates to a composition and process for treating a surface of copper-containing metal. More particularly, this invention relates to a surface treatment composition and process that are well suited to the purpose of imparting migration resistance, solder resistance, and robust adhesiveness to the surface of copper-containing metals.
BACKGROUND ART
Copper is in wide use, ranging from decorative and ornamental applications to its applications in the electronic industry, and like most other metals it undergoes oxidation when exposed to the air. This causes a decline in its solderability and electrical conductivity, which has prompted the implementation of various countermeasures.
For example, in the electronics industry this deterioration in solderability and electrical conductivity of the copper foil used for printed circuit boards has been prevented by inhibiting oxidation of the copper surface by the application thereto of an organic inhibitor as a surface treatment.
However, the recent direction in the electronics industry has been toward lighter, thinner, smaller, and higher-performing components, and this has required printed circuit boards to support higher densities and smaller conductor paths. This in turn has increased the requirements in the areas of solder wettability, solder resistance, durability of adhesion to the copper foil, and migration resistance of the copper. These issues are usually handled by inducing an improvement in these properties by directly treating the surface of the copper foil with an antioxidant or copper inhibitor or by adding an antioxidant or copper inhibitor to the adhesive. that uses an organic inhibitor. In this method, copper migration is inhibited by dipping the printed-circuit board, while heating under elevated pressure, in a solution that contains a metal deactivator or copper inhibitor. However, despite infiltration of the treatment agent while heating under elevated pressure, this method has difficulty achieving a uniform infiltration and as a result produces a variable migration resistance. In addition, even though the treatment agent infiltrates into the adhesion interface, etc., due to the application of heat and pressure, the durability of adhesion to the copper under high temperature/high humidity conditions is unsatisfactory. and improves antitracking through the addition of a triazinethiol copper inhibitor to the adhesive for the copper-clad laminate. While this type of adhesive does prevent copper migration in those regions where it directly contacts the copper, almost no effect is obtained in regions not in contact with the adhesive.
Thus, no surface treatment agent is currently available that is able to provide the surface of copper-containing metals with a satisfactory performance from all perspectives, i.e., oxidation resistance, migration resistance, solder resistance, and robustness of adherence.
DISCLOSURE OF THE INVENTION
Problems to be Solved by the Invention
The present invention takes as its object the introduction of a surface treatment agent that avoids at least some, and preferably all, of the problems described above for the prior art, or in specific terms that inhibits the susceptibility to oxidation and migration that is characteristic of copper-containing metals while, in its preferred embodiments, simultaneously achieving the solder resistance and durability of adhesion needed from surface treatment agents.
Description of the Invention, Including Preferred Embodiments
It has been discovered that the application of a surface treatment agent containing a silane coupling agent of certain particular types and at least one copper inhibitor to the surface of copper-containing metals can form a coating that gives an excellent performance in the areas of migration resistance, solder resistance, and durability of adherence. The present invention was achieved as a result of this discovery.
In specific terms, accordingly, in one of its embodiments the present invention relates to a composition for treat
REFERENCES:
Derwent Abstract #89-336606/46, abstract of Japanese Specification No. 01-251785, Oct. 1989.
Derwent Abstract No. 93-129239/16, abstract of Japanese Patent Specification No. 05-065466, Mar. 1993.
Aoyama Masayuki
Kawaguchi Jyun
Morita Ryoji
Green Anthony
Henkel Corporation
Jaeschke Wayne C.
Jaeschke, Jr. Wayne C.
Wisdom, Jr. Norvell E.
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