Composition and methods for bonding electrical components

Details Composition and methods for bonding electrical components Composition and methods for bonding electrical components

1990-01-24

1993-06-01

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29464, 1563073, 156315, 156327, 1563311, 360104, 524 81, B32B 3100

Patent

active

052156087

ABSTRACT:
Adhesive Compositions comprising a solid component of from about 60 to 90 percent of a solid resin and from about 10 to 40 percent flexible resin which are suspended in a liquid component comprised of from about 80 to 98 percent solvent and from about 2 to 20 percent curing agent and wherein the solid component comprises from about 10 to about 30 percent of the overall composition and the liquid component comprises about 70 to 90 percent of the overall adhesive composition can be used to "quick tack" electrical components in minimal amounts of time and with minimal amounts of electrical resistance between the components.

REFERENCES:
patent: 4866836 (1989-09-01), von Brandt et al.
patent: 4920438 (1990-04-01), Furakawa et al.

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