Composition and method relating to a hot melt adhesive

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

Reexamination Certificate

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Details

C524S505000, C524S291000, C524S343000, C524S487000

Reexamination Certificate

active

10654167

ABSTRACT:
The present invention includes methods and compositions relating to a hot melt adhesive that includes ethylene methyl methacrylate and a tackifying resin.

REFERENCES:
patent: 3287335 (1966-11-01), Stuetz
patent: 3658741 (1972-04-01), Knutson et al.
patent: 3949016 (1976-04-01), Agouri et al.
patent: 4197380 (1980-04-01), Chao et al.
patent: 4284542 (1981-08-01), Boyce et al.
patent: 4404299 (1983-09-01), Decroix
patent: 4618640 (1986-10-01), Tsuchida et al.
patent: 4654389 (1987-03-01), Graham et al.
patent: 4830926 (1989-05-01), Mostert
patent: 5149741 (1992-09-01), Alper et al.
patent: 5286781 (1994-02-01), Gotoh et al.
patent: 5382615 (1995-01-01), Godfrey
patent: 5401791 (1995-03-01), Milks
patent: 5401792 (1995-03-01), Babu et al.
patent: 5427850 (1995-06-01), Gotoh et al.
patent: 5534575 (1996-07-01), Foster et al.
patent: 5747573 (1998-05-01), Ryan
patent: 5928782 (1999-07-01), Albrecht
patent: 6103814 (2000-08-01), vanDrongelen et al.
patent: 6410627 (2002-06-01), Paul et al.
patent: 6562888 (2003-05-01), Frihart et al.
patent: 6946528 (2005-09-01), Domine et al.
patent: 2002/0161085 (2002-10-01), Gibes et al.
patent: 2002/0193474 (2002-12-01), Daily et al.
patent: 25 23 617 (1976-12-01), None
patent: 1 431 070 (1976-04-01), None
patent: 5604279 (1981-04-01), None
patent: 56041279 (1981-04-01), None
patent: 9304704 (1993-06-01), None
patent: WO 00/00565 (2000-01-01), None
patent: WO 01/34719 (2001-05-01), None

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