Composition and method of bonding gold to a ceramic substrate an

Details Composition and method of bonding gold to a ceramic substrate an Composition and method of bonding gold to a ceramic substrate an

1974-03-22

1976-07-13

Martin, William D.

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106 1, 252514, 252518, 427 96, 427123, 427229, 427282, 428450, B05D 300

Patent

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039695700

ABSTRACT:
A composition for, as well as a method of bonding gold to a ceramic and a bonded gold article which includes a composition of gold and copper oxide for bonding a gold layer to a ceramic substrate. Gold powder and copper oxide particles define a solid composition mixture wherein the copper oxide has a weight percentage in the preferred region between 1.2% and 1.4%. Organic binder is added to a predetermined amount of copper oxide particles and blended. The gold powder is incorporated into the copper oxide and organic binder to form a total composition mixture. The orgaic binder has a weight percentage of the total composition mixture within the preferred range of 50% to 85%. The total composition mixture is blended and applied to a ceramic substrate. The coated ceramic article is fired within the preferred temperature range 1020.degree.C. to 1040.degree.C. Copper oxide crystals are formed which impregnate the ceramic substrate and form a high strength bond between the gold layer and the ceramic substrate.

REFERENCES:
patent: 3021233 (1962-02-01), Fenity
patent: 3380835 (1968-04-01), Short
patent: 3407081 (1968-10-01), Ballard
patent: 3440182 (1969-04-01), Hoffman
patent: 3516949 (1970-06-01), Hoffman
patent: 3545986 (1970-12-01), Short

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