Composition and method for stripping tin and tin-lead from coppe

Details Composition and method for stripping tin and tin-lead from coppe Composition and method for stripping tin and tin-lead from coppe

1998-05-11

1999-07-27

Utech, Benjamin

Etching a substrate: processes

Nongaseous phase etching of substrate

Substrate is multilayered

252 791, 252 792, 252 794, 156656, C23D 100

Patent

active

059285290

ABSTRACT:
A composition and method for stripping tin or tin-lead alloys, and any underlying copper-tin intermetallic, from a copper surface. The composition includes an aqueous solution of approximately 5-60% nitric acid by weight, approximately 0.5-30% ferric nitrate by weight, and a nitric acid stabilizer selected from the group consisting of an amino-triazole, an amino-isoxazole, and a linear amino sulfone in the form H.sub.2 N-SO.sub.2 -R, where R is any alkyl or benzene group, wherein the stabilizer is present at a concentration sufficient to inhibit exothermic conditions, emission of toxic NOx gas, and copper attack. A soluble source of halogen ion, such as hydrochloric acid, can be added to the composition to yield a uniform, reflective, bright pink copper appearance, and to further reduce sludge formation. In addition, sludge formation can be eliminated by adding a soluble source of sulfate ion (SO.sub.4.sup.-2) to the composition.

REFERENCES:
patent: 3770530 (1973-11-01), Fujimoto
patent: 3948703 (1976-04-01), Kushibe
patent: 4713144 (1987-12-01), Schiller
patent: 5219484 (1993-06-01), Krulik
patent: 5244539 (1993-09-01), McGrath et al.
patent: 5505872 (1996-04-01), Kruilik et al.
patent: 5512201 (1996-04-01), Singh et al.

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