Composition and method for selective plating

Details Composition and method for selective plating Composition and method for selective plating

1997-04-30

1998-12-01

Talbot, Brian K.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427304, 427437, 4274431, 427301, 106 105, 106 111, 205125, 205163, 205210, B05D 512

Patent

active

058435174

ABSTRACT:
This invention proposes the use of an activator solution comprising precious metal ions and an oxidizing agent for the selective activation and plating of metallic surfaces. The invention is particularly useful in plating exposed copper surfaces on printed circuit boards without substantial extraneous plating on the soldermask surfaces.

REFERENCES:
patent: 3900614 (1975-08-01), Lando
patent: 3935345 (1976-01-01), Lema
patent: 4153746 (1979-05-01), Kilthau
patent: 4187198 (1980-02-01), Zeblinsky
patent: 4668348 (1987-05-01), Jones et al.
patent: 4933010 (1990-06-01), Okabayashi

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