Composition and method for selective plating

Details Composition and method for selective plating Composition and method for selective plating

1995-03-22

1996-05-21

Silverberg, Sam

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

422304, B05D 512

Patent

active

055187609

ABSTRACT:
This invention proposes the addition of imidazole and imidazole derivatives to various activator solutions for the selective activation and plating of metallic surfaces. The invention is particularly useful in plating exposed copper surfaces on printed circuit boards without substantial extraneous plating on the solder mask surfaces.

REFERENCES:
patent: 4863758 (1989-09-01), Rhodenizer
patent: 4940181 (1990-07-01), Juskey, Jr. et al.
patent: 5160579 (1992-11-01), Larson
patent: 5173130 (1992-12-01), Kinoshita et al.
patent: 5235139 (1993-08-01), Bingston et al.
patent: 5468515 (1995-11-01), Ferrier

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