Composition and method for removing photosensitive resin film fr

Details Composition and method for removing photosensitive resin film fr Composition and method for removing photosensitive resin film fr

1986-12-19

1988-09-13

Lacey, David L.

Compositions

Chemiluminescent

252 795, 156664, 156668, B09K 1300, B09K 1302

Patent

active

047708050

ABSTRACT:
An improved composition consisting essentially of an alkali solution and 3,5-dimethyl pyrazole, for removing a photosensitive resin film from a baseboard for an integrated circuit following formation of a tin-lead solder circuit on the baseboard. A method for removing the photosensitive resin without dissolving the tin-lead circuit by applying the improved composition.

REFERENCES:
patent: 4098720 (1978-07-01), Hwa
patent: 4101441 (1978-07-01), Hwa et al.
patent: 4483739 (1984-11-01), Too et al.

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