Composition and method for reducing dishing in patterned metal d

Details Composition and method for reducing dishing in patterned metal d Composition and method for reducing dishing in patterned metal d

1998-09-17

2000-11-21

Koslow, C. Melissa

Etching a substrate: processes

Nongaseous phase etching of substrate

Using film of etchant between a stationary surface and a...

51307, 51309, 438692, 438693, B24B 100

Patent

active

061498300

ABSTRACT:
A composition for reducing dishing in patterned large metal surfaces embedded in a dielectric as a workpiece during chemical mechanical polishing, comprising: a viscosity increasing amount of viscosity enhancer in replacement of a portion of deionized water in a slurry containing an abrasive.

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Kumar et al., "Chemical-Mechanical Polishing of Copper in Glycerol Based Slurries", Mat. Res. Soc. Symp. Proc., vol. 427, pp. 237-242 (1996). No Month.
Nogo et al., "Slurry Engineering for Self-Stopping, Dishing Free SiO2-CMP", IEDM, pp. 349-352, .COPYRGT.1996 IEEE. No Month.

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