Composition and method for reducing copper oxide to metallic cop

Details Composition and method for reducing copper oxide to metallic cop Composition and method for reducing copper oxide to metallic cop

1995-12-19

1998-02-24

Bell, Janyce

Coating processes

With pretreatment of the base

4273881, 427399, 427444, B05D 300

Patent

active

057210144

ABSTRACT:
A composition for reducing a copper oxide layer to metallic copper so as to facilitate bonding a resin to the metallic copper is disclosed. The composition is an aqueous reducing solution containing morpholine borane.

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patent: 4617205 (1986-10-01), Darken
patent: 4642161 (1987-02-01), Akahoshi et al.
Akahoshi et al., New Copper Surface Treatment for Polyinride Multilayer Printed Wiring Boards, Circuit World 14(1) (1987) (no mo.).
Hitachi, Ltd., Technical Publication: Chemical Reduction Treatment of Copper Oxide: DMAB Method (undated).

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