Composition and method for reducing copper oxide to metallic cop

Coating processes – With pretreatment of the base

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4273881, 427399, 427444, B05D 300

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active

057210144

ABSTRACT:
A composition for reducing a copper oxide layer to metallic copper so as to facilitate bonding a resin to the metallic copper is disclosed. The composition is an aqueous reducing solution containing morpholine borane.

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Akahoshi et al., New Copper Surface Treatment for Polyinride Multilayer Printed Wiring Boards, Circuit World 14(1) (1987) (no mo.).
Hitachi, Ltd., Technical Publication: Chemical Reduction Treatment of Copper Oxide: DMAB Method (undated).

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