Composition and method for reducing copper oxide to metallic cop

Details Composition and method for reducing copper oxide to metallic cop Composition and method for reducing copper oxide to metallic cop

1998-02-25

1999-05-04

Powell, William

Compositions

Etching or brightening compositions

216 20, 216 34, 216105, B44C 122

Patent

active

059001860

ABSTRACT:
A composition for reducing a copper oxide layer to metallic copper so as to facilitate bonding a resin to the metallic copper is disclosed. The composition is an aqueous reducing solution containing a cyclic borane compound. Examples of such cyclic borane compounds include those having nitrogen or sulfur as a ring-forming member, such as morpholine borane, piperidine borane, pyridine borane, piperazine borane, 2,6-Iutidine borane, 4-methylmorpholine borane, and 1,4-oxathiane borane, and also N,N-diethylaniline borane.

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Hitachi, Ltd., Technical Publication: Chemical Reduction Treatment of Copper Oxide: DMAB Method (undated).

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