Composition and method for reducing copper oxide to metallic cop

Details Composition and method for reducing copper oxide to metallic cop Composition and method for reducing copper oxide to metallic cop

1999-01-19

2000-07-11

Nguyen, Ngoc-yen

Coating processes

With pretreatment of the base

427399, 427409, 427329, 423604, C01G 302, C23C 2263, C03J 504, H05K 338

Patent

active

060869569

ABSTRACT:
A composition for reducing a copper oxide layer to metallic copper so as to facilitate bonding a resin to the metallic copper is disclosed. The composition is an aqueous reducing solution containing a cyclic borane compound. Examples of such cyclic borane compounds include those having nitrogen or sulfur as a ring-forming member, such as morpholine borane, piperidine borane, pyridine borane, piperazine borane, 2,6-Iutidine borane, 4-methylmorpholine borane, and 1,4-oxathiane borane, and also N,N-diethylaniline borane.

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