Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Reexamination Certificate
2011-06-14
2011-06-14
Webb, Gregory E (Department: 1796)
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
C252S079100, C134S001300
Reexamination Certificate
active
07960328
ABSTRACT:
A removal composition and process for removing low-k dielectric material, etch stop material, and/or metal stack material from a rejected microelectronic device structure having same thereon. The removal composition includes hydrofluoric acid. The composition achieves at least partial removal of the material(s) from the surface of the microelectronic device structure having same thereon, for recycling and/or reuse of said structure, without damage to the underlying polysilicon or bare silicon layer employed in the semiconductor architecture.
REFERENCES:
patent: 3559281 (1971-02-01), Mayberry et al.
patent: 3923567 (1975-12-01), Lawrence
patent: 4032621 (1977-06-01), Meadows
patent: 4101425 (1978-07-01), Young et al.
patent: 5320709 (1994-06-01), Bowden et al.
patent: 5622875 (1997-04-01), Lawrence
patent: 5705089 (1998-01-01), Sugihara et al.
patent: 5792274 (1998-08-01), Tanabe et al.
patent: 5855735 (1999-01-01), Takada et al.
patent: 5962385 (1999-10-01), Maruyama et al.
patent: 5968848 (1999-10-01), Tanabe et al.
patent: 5981454 (1999-11-01), Small
patent: 5981484 (1999-11-01), Davidson
patent: 6140211 (2000-10-01), Nanda et al.
patent: 6191085 (2001-02-01), Cooper et al.
patent: 6235693 (2001-05-01), Cheng et al.
patent: 6284628 (2001-09-01), Kuwahara et al.
patent: 6406923 (2002-06-01), Inoue et al.
patent: 6547647 (2003-04-01), Chang
patent: 6554912 (2003-04-01), Sahbari
patent: 6627587 (2003-09-01), Naghshineh et al.
patent: 6693047 (2004-02-01), Lu et al.
patent: 6706636 (2004-03-01), Matsukawa
patent: 6761625 (2004-07-01), Rojhantalab et al.
patent: 6762132 (2004-07-01), Yates
patent: 6770426 (2004-08-01), Vaartstra
patent: 6773873 (2004-08-01), Seijo et al.
patent: 6831048 (2004-12-01), Kezuka et al.
patent: 6849200 (2005-02-01), Baum et al.
patent: 6869921 (2005-03-01), Koito et al.
patent: 7056648 (2006-06-01), Cooper et al.
patent: 7119052 (2006-10-01), Korzenski et al.
patent: 7208325 (2007-04-01), Wang et al.
patent: 7250391 (2007-07-01), Kanno et al.
patent: 7300601 (2007-11-01), Liu et al.
patent: 7419911 (2008-09-01), Chelle et al.
patent: 7419945 (2008-09-01), Hsu
patent: 7456140 (2008-11-01), Small et al.
patent: 2002/0119245 (2002-08-01), Verhaverbeke
patent: 2002/0127859 (2002-09-01), Wu
patent: 2003/0027430 (2003-02-01), Stevens et al.
patent: 2004/0009883 (2004-01-01), Ikemoto et al.
patent: 2004/0029753 (2004-02-01), Ikemoto et al.
patent: 2004/0050406 (2004-03-01), Sehgal
patent: 2004/0180300 (2004-09-01), Minsek et al.
patent: 2004/0229461 (2004-11-01), Darsillo et al.
patent: 2005/0084792 (2005-04-01), Yokoi et al.
patent: 2005/0183740 (2005-08-01), Fulton et al.
patent: 2005/0197265 (2005-09-01), Rath et al.
patent: 2005/0205515 (2005-09-01), Saga et al.
patent: 2006/0009011 (2006-01-01), Barrett et al.
patent: 2006/0063687 (2006-03-01), Minsek et al.
patent: 2006/0138399 (2006-06-01), Itano et al.
patent: 2006/0154186 (2006-07-01), Minsek et al.
patent: 2006/0154484 (2006-07-01), Hwang et al.
patent: 2006/0166847 (2006-07-01), Walker et al.
patent: 2006/0199749 (2006-09-01), Suzuki et al.
patent: 2006/0249482 (2006-11-01), Wrschka et al.
patent: 2007/0082497 (2007-04-01), Lee et al.
patent: 2007/0087580 (2007-04-01), Kang et al.
patent: 2008/0006305 (2008-01-01), Bernhard et al.
patent: 2008/0124930 (2008-05-01), Lim et al.
patent: 2008/0125342 (2008-05-01), Visintin et al.
patent: 2008/0318426 (2008-12-01), Kim et al.
patent: 11067632 (1999-03-01), None
patent: 0071782 (2000-11-01), None
patent: 2005019499 (2005-03-01), None
patent: WO2006023061 (2006-03-01), None
patent: 2006074316 (2006-07-01), None
patent: 2006110645 (2006-10-01), None
patent: 2006113222 (2006-10-01), None
patent: 2006113621 (2006-10-01), None
patent: 2006127885 (2006-11-01), None
patent: 2006133253 (2006-12-01), None
patent: 2006138235 (2006-12-01), None
patent: 2007044446 (2007-04-01), None
patent: 2007044447 (2007-04-01), None
patent: 2007047365 (2007-04-01), None
patent: 2008039730 (2008-04-01), None
European Patent Office, Supplemental European Search Report, Jan. 22, 2009.
Jiang Ping
King Mackenzie
Korzenski Michael B.
Visintin Pamela M.
Advanced Technology & Materials Inc.
Fuierer Tristan A.
Lin Chih-Sheng
Moore & Van Allen PLLC
Webb Gregory E
LandOfFree
Composition and method for recycling semiconductor wafers... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Composition and method for recycling semiconductor wafers..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composition and method for recycling semiconductor wafers... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2649418